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Ensinger: Material for high-frequency applications

24.06.2020

New LCP compound enables microcomponents with filigree conductor path structures
Ensinger has developed a new compound for laser direct structuring based on a liquid crystalline polymer (LCP) and designed for thin-walled three-dimensional microcomponents with very fine conductor paths. The innovative filler concept increases the reliability of the conductor structures under alternating climatic and mechanical loads. Good dimensional stability and stiffness characterize the compound.

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