As a joining technology, adhesive bonding technology covers topics ranging from the chemistry and physics of adhesives, joining parts and surfaces to the mechanical behaviour and dimensioning of bonded joints for bonded structures. Since adhesive bonding technology as well as the joining of CFRP with other materials will play a decisive role in the future, especially for multi-material lightweight design, the long-term goal is to identify unanswered questions in this context and find approaches to solutions.
The working group would therefore like to contribute to an overarching exchange of experience in cooperation with the working groups “Materials and Component Testing” and “Engineering”. In addition, there will be regular lectures on the various aspects of adhesive bonding technologies presented by research institutes and universities.