Events & Dates

2nd Rapperswil International Bonding Forum RIBF 2022

bis 17.06.2022
Event Location:

OST – Eastern Switzerland University of Applied Sciences in Rapperswil
Oberseestrasse 10, 8640 Rapperswil, Switzerland

The conference focuses on Bonding Technology and especially on the topics of joint design for industrial applications, mechanical properties of adhesive joints, adhesion and surface treatments, quality procedures and standardisation.

The conference is chaired by Pierre Jousset, Professor at the OST, and Head of Joining Technologies at the IWK, Institute for Materials Technology and Plastics Processing.

This two-day conference has been planned with the aim to bring together engineers and researchers from the industry, engineering schools and universities, to exchange about the state of the art and the latest innovations in the field of bonding technology. The contents of the conference focuses on applied research and industrial applications.

Further information

Registration online